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課程名稱 |
半導體電子產品工程
Semiconductor Electronic Product Engineering |
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開課學期 |
107-1 |
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授課對象 |
電機資訊學院 電機工程學研究所 |
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授課教師 |
潘正聖 |
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課號 |
EEE5054 |
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課程識別碼 |
943 U0560 |
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班次 |
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學分 |
3.0 |
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全/半年 |
半年 |
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必/選修 |
選修 |
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上課時間 |
星期三6,7,8(13:20~16:20) |
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上課地點 |
電二141 |
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備註 |
總人數上限：15人 |
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課程簡介影片 |
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核心能力關聯 |
核心能力與課程規劃關聯圖 |
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課程大綱
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為確保您我的權利,請尊重智慧財產權及不得非法影印
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課程概述 |
1.Overview of semiconductor electronics industry
2.Historical key events in semiconductor electronics
3.Multi-disciplinary fields of knowledge in product engineering
4.Fundamentals of IC fabrication from wafer to functional chip
5.Fundamentals of device engineering
6.Fundamentals of circuit design engineering
7.Fundamentals of yield engineering – business success factor
8.Electrical failure analysis to identify electrical signature/failing location
9.Physical failure analysis to identify root-cause
10.Methodology for failure debugging and yield enhancement
11.Fundamentals of packaging engineering
12.Fundamentals of quality/reliability engineering
13.Case study
14.Industry outlook |
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課程目標 |
Problem solving techniques in debugging semiconductor electronic products, covering multi-disciplinary engineering domains of process, device, circuit design, product/test, Q/R, etc. |
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課程要求 |
需具備下列相關知識：
1.Semiconductor process technology, 半導體製程技術概論
2.Semiconductor device physics, 半導體元件物理
3.Digital circuit design, 電子電路原理 |
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預期每週課後學習時數 |
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Office Hours |
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指定閱讀 |
1.Digital Integrated Circuits: A Design Perspective, 2nd edition by Jan M. Rabaey, go to this website for more information: https://bwrcs.eecs.berkeley.edu/Classes/IcBook。(如有需要，洽東華書局或新月書局)
2.Notes (講義) |
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參考書目 |
1.VLSI Technology, 2nd edition by S. Sze
2.Physics of Semiconductor Devices, 2nd edition by S. Sze
3.Applied Reliability, 3rd edition by P. Tobias
4.Reliability Physics and Engineering, 2nd edition by J. W. McPerson |
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評量方式
(僅供參考) |
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No. |
項目 |
百分比 |
說明 |
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1. |
期中考口試 |
50% |
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2. |
期末書面暨口頭報告 |
50% |
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